What kind of air pressure is needed to clean aluminum materials?

Published Time:

2018-11-27

Due to the increasingly complex purification processes and higher processing precision, the required temperature fluctuation range is becoming smaller and smaller. For example, in the lithography exposure process of large-scale integrated circuit production, the difference between the thermal expansion coefficients of the mask material (glass and silicon) is becoming increasingly smaller. A temperature increase of a 100-micrometer diameter silicon wafer to a certain degree causes a linear expansion of 0.24μm in the aluminum material, therefore, a stable temperature of ±0.1 degree is required. The required humidity is generally lower because products contaminated by human sweat will be polluted, especially as they are sensitive to sodium. Semiconductor factories should not exceed 25 degrees. High humidity generates...

Due to the increasingly complex purification processes and higher processing precision, the required temperature fluctuation range is becoming smaller and smaller. For example, in the photolithography exposure process of large-scale integrated circuit production, the difference between the thermal expansion coefficients of the mask material (glass) and silicon is becoming increasingly critical. A temperature increase of a 100-micrometer silicon wafer to a certain degree causes a linear expansion of 0.24μm in the aluminum material, therefore, a stable temperature of ±0.1 degree is necessary. The required humidity is generally lower because products contaminated by human sweat will be problematic, especially for sodium-sensitive semiconductor factories; these factories should ideally not exceed 25 degrees Celsius.

　　High humidity creates more problems. When the relative humidity exceeds 55%, condensation will occur on the inner walls of pipes, which, if in contact with sensitive equipment or circuits, can cause various problems. A relative humidity of 50% is considered rust-preventive. Furthermore, in high-humidity air, water molecules adhere to dust particles on the wafer surface, making them difficult to remove. The higher the relative humidity, the more difficult it is to remove the adhered particles. If the relative humidity is below 30%, electrostatic effects easily cause particles to adhere to the surface, increasing the difficulty of removal and potentially leading to breakdowns in many semiconductor devices. For wafer production, the optimal temperature range is 35-45%.

　　Pressure Requirements in the Cleanroom:

　　 In most cleanrooms, to prevent external contamination, the internal pressure (static pressure) needs to be maintained higher than the external pressure (static pressure). The pressure difference should meet the following general guidelines:

　　1. The pressure in the clean space is higher than the pressure in the non-clean space.

　　2. The pressure in a higher-level cleanroom is higher than the pressure in an adjacent lower-level cleanroom.

　　3. For cleanrooms of similar cleanliness levels, the higher-level room maintains a higher pressure.

　　The pressure difference is maintained by supplying fresh air; the fresh air compensates for the leakage of air from the gaps.

More Information:

Public Notice on the Environmental Acceptance Inspection of Phase Two of the 30,000-ton Annual Output Project for Porous Microchannel Aluminum Alloy Tubes

2023-10-25

Public announcement of environmental impact assessment for a project to produce 30,000 tons of energy-efficient and environmentally friendly aluminum pipes and aluminum materials annually

2023-09-13

Several common problems and solutions in the processing of industrial aluminum profiles

Having worked in the industrial aluminum profile industry for many years, I've often encountered several issues during the processing of industrial aluminum profiles. Today, I'll summarize these problems and explain some conventional solutions for your reference. 1. When the temperature is too low during the extrusion of industrial aluminum profiles, and the extrusion speed is too slow, the temperature of the profiles at the outlet of the extruder cannot reach the solution temperature, thus failing to achieve solution strengthening; Solution: Reasonably control the extrusion temperature and speed to ensure that the temperature of the profiles at the extruder outlet remains above the low solution temperature; 2. There are few fans at the outlet of industrial aluminum alloy profiles, and the air volume is insufficient, resulting in slow cooling speed and the inability to cool the industrial aluminum alloy profiles within a short time

2018-11-27